TS991SNL500T3
- Part Number
- TS991SNL500T3
- Product Category
- Solder
- Manufacturer
- Chip Quik Inc.
- Description
- SOLDER PASTE THERMALLY STABLE NC
- Packaging
- Bulk
- RoHS Status
- RoHS Compliant
- Currency
- USD
- Datasheet
Specification
- Part Status Active
- Wire Gauge -
- Shelf Life Start Date of Manufacture
- Diameter -
- Shelf Life 12 Months
- Flux Type No-Clean
- Process Lead Free
- Type Solder Paste
- Mesh Type 3
- Form Jar, 17.64 oz (500g)
- Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Melting Point 423°F (217°C)
- RoHS Status ROHS3 Compliant
- Moisture Sensitivity Level (MSL) 1 (Unlimited)
- REACH Status REACH Unaffected
- ECCN EAR99
- HTSUS 3810.10.0000
