TS991SNL35T3
- Part Number
- TS991SNL35T3
- Product Category
- Solder
- Manufacturer
- Chip Quik Inc.
- Description
- THERMALLY STABLE SOLDER PASTE NC
- Packaging
- Bulk
- RoHS Status
- RoHS Compliant
- Currency
- USD
- Datasheet
Specification
- Part Status Active
- Wire Gauge -
- Weight -
- Shipping Info -
- Shelf Life Start Date of Manufacture
- Diameter -
- Shelf Life 12 Months
- Flux Type No-Clean
- Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C)
- Type Solder Paste
- Mesh Type 3
- Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Melting Point 423°F (217°C)
- Process -
- Form Syringe, 1.23 oz (34.869g)
- RoHS Status ROHS3 Compliant
- Moisture Sensitivity Level (MSL) Not Applicable
- REACH Status REACH Unaffected
- ECCN EAR99
- HTSUS 3810.10.0000
