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TS991AX500T4

Part Number
TS991AX500T4
Product Category
Solder
Manufacturer
Chip Quik Inc.
Description
SOLDER PASTE THERMALLY STABLE NC
Packaging
Bulk
RoHS Status
RoHS Compliant
Currency
USD
PDF
Datasheet
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Specification

  • Part Status Active
  • Wire Gauge -
  • Shelf Life Start Date of Manufacture
  • Diameter -
  • Composition Sn63Pb37 (63/37)
  • Melting Point 361°F (183°C)
  • Process Leaded
  • Shelf Life 12 Months
  • Flux Type No-Clean
  • Type Solder Paste
  • Form Jar, 17.64 oz (500g)
  • Mesh Type 4
  • RoHS Status RoHS non-compliant
  • Moisture Sensitivity Level (MSL) 1 (Unlimited)
  • REACH Status REACH Affected
  • ECCN EAR99
  • HTSUS 3810.10.0000

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