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TS991AX35T4

Part Number
TS991AX35T4
Product Category
Solder
Manufacturer
Chip Quik Inc.
Description
THERMALLY STABLE SOLDER PASTE NC
Packaging
Bulk
RoHS Status
RoHS Compliant
Currency
USD
PDF
Datasheet
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Specification

  • Part Status Active
  • Wire Gauge -
  • Weight -
  • Shipping Info -
  • Shelf Life Start Date of Manufacture
  • Diameter -
  • Composition Sn63Pb37 (63/37)
  • Melting Point 361°F (183°C)
  • Process Leaded
  • Shelf Life 12 Months
  • Flux Type No-Clean
  • Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C)
  • Type Solder Paste
  • Mesh Type 4
  • Form Syringe, 1.23 oz (34.869g)
  • RoHS Status ROHS3 Compliant
  • Moisture Sensitivity Level (MSL) Not Applicable
  • REACH Status REACH Unaffected
  • ECCN EAR99
  • HTSUS 3810.10.0000

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