SMDSWLF.006 1G
- Part Number
- SMDSWLF.006 1G
- Product Category
- Solder
- Manufacturer
- Chip Quik Inc.
- Description
- SOLDER WIRE SN96.5/AG3/CU0.5
- Packaging
- Bulk
- RoHS Status
- RoHS Compliant
- Currency
- USD
- Datasheet
Specification
- Part Status Active
- Wire Gauge -
- Weight -
- Shelf Life -
- Shipping Info -
- Storage/Refrigeration Temperature -
- Shelf Life Start -
- Type Wire Solder
- Process Lead Free
- Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Melting Point 423 ~ 428°F (217 ~ 220°C)
- Flux Type No-Clean, Water Soluble
- Diameter 0.006" (0.15mm)
- Form Spool, 0.035 oz (1g)
- RoHS Status ROHS3 Compliant
- Moisture Sensitivity Level (MSL) 1 (Unlimited)
- REACH Status REACH Unaffected
- ECCN EAR99
- HTSUS 8311.30.6000
