SMDLTLFP50T6
- Part Number
- SMDLTLFP50T6
- Product Category
- Solder
- Manufacturer
- Chip Quik Inc.
- Description
- SOLDER PASTE IN JAR 50G (T6) SN4
- Packaging
- Bulk
- RoHS Status
- RoHS Compliant
- Currency
- USD
- Datasheet
Specification
- Part Status Active
- Wire Gauge -
- Weight -
- Shipping Info -
- Shelf Life Start Date of Manufacture
- Diameter -
- Flux Type No-Clean
- Process Lead Free
- Shelf Life 6 Months
- Storage/Refrigeration Temperature 37°F ~ 46°F (3°C ~ 8°C)
- Type Solder Paste
- Form Jar, 1.76 oz (50g)
- Melting Point 280°F (138°C)
- Composition Sn42Bi57.6Ag0.4 (42/57.6/0.4)
- RoHS Status ROHS3 Compliant
- Moisture Sensitivity Level (MSL) Not Applicable
- REACH Status REACH Unaffected
- ECCN EAR99
- HTSUS 3810.10.0000
