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NC191SNL250

Part Number
NC191SNL250
Product Category
Solder
Manufacturer
Chip Quik Inc.
Description
SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging
Bulk
RoHS Status
RoHS Compliant
Currency
USD
PDF
Datasheet
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Specification

  • Part Status Active
  • Wire Gauge -
  • Shelf Life Start Date of Manufacture
  • Diameter -
  • Flux Type No-Clean
  • Process Lead Free
  • Shelf Life 6 Months
  • Storage/Refrigeration Temperature 37°F ~ 46°F (3°C ~ 8°C)
  • Type Solder Paste
  • Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
  • Form Jar, 8.8 oz (250g)
  • Mesh Type 4
  • Melting Point 422 ~ 428°F (217 ~ 220°C)
  • RoHS Status ROHS3 Compliant
  • Moisture Sensitivity Level (MSL) 1 (Unlimited)
  • REACH Status REACH Unaffected
  • ECCN EAR99
  • HTSUS 3810.10.0000

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