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JET551SNL10T5

Part Number
JET551SNL10T5
Product Category
Solder
Manufacturer
Chip Quik Inc.
Description
JET PRINTING SOLDER PASTE SN96.5
Packaging
Bulk
RoHS Status
RoHS Compliant
Currency
USD
PDF
Datasheet
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Specification

  • Part Status Active
  • Wire Gauge -
  • Weight -
  • Shipping Info -
  • Shelf Life Start Date of Manufacture
  • Storage/Refrigeration Temperature -
  • Diameter -
  • Shelf Life 12 Months
  • Flux Type No-Clean
  • Type Solder Paste
  • Form Syringe, 1.23 oz (35g), 10cc
  • Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
  • Melting Point 423 ~ 428°F (217 ~ 220°C)
  • Process -
  • RoHS Status ROHS3 Compliant
  • Moisture Sensitivity Level (MSL) 1 (Unlimited)
  • REACH Status REACH Unaffected
  • ECCN EAR99
  • HTSUS 3810.10.0000

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