IPC0170-S
- Part Number
- IPC0170-S
- Product Category
- Solder Stencils, Templates
- Manufacturer
- Chip Quik Inc.
- Description
- BGA-24 (1MM PITCH, 8X6MM BODY) S
- Packaging
- Bulk
- RoHS Status
- RoHS Compliant
- Currency
- USD
- Datasheet
Specification
- Part Status Active
- Number of Positions 24
- Pitch 0.039" (1.00mm)
- Material Stainless Steel
- Thickness 0.0040" (0.102mm)
- Type BGA
- Outer Dimension 1.300" L x 0.900" W (33.02mm x 22.86mm)
- Thermal Center Pad -
- Inner Dimension 0.315" L x 0.236" W (8.00mm x 6.00mm)
- RoHS Status ROHS3 Compliant
- Moisture Sensitivity Level (MSL) Not Applicable
- REACH Status REACH Unaffected
- ECCN EAR99
- HTSUS 8515.19.0000
