BGA0034-S
- Part Number
- BGA0034-S
- Product Category
- Solder Stencils, Templates
- Manufacturer
- Chip Quik Inc.
- Description
- BGA-676 (1.0 MM PITCH, 26 X 26 G
- Packaging
- Bulk
- RoHS Status
- RoHS Compliant
- Currency
- USD
- Datasheet
Specification
- Part Status Active
- Pitch 0.039" (1.00mm)
- Material Stainless Steel
- Thickness 0.0040" (0.102mm)
- Type BGA
- Thermal Center Pad -
- Outer Dimension 2.600" L x 1.800" W (66.04mm x 45.72mm)
- Number of Positions 676
- Inner Dimension 1.024" L x 1.024" W (26.00mm x 26.00mm)
- RoHS Status ROHS3 Compliant
- Moisture Sensitivity Level (MSL) 1 (Unlimited)
- REACH Status REACH Unaffected
- ECCN EAR99
- HTSUS 7220.90.0080
