BGA0023-S
- Part Number
- BGA0023-S
- Product Category
- Solder Stencils, Templates
- Manufacturer
- Chip Quik Inc.
- Description
- BGA-100 (0.4 MM PITCH, 10 X 10 G
- Packaging
- Bulk
- RoHS Status
- RoHS Compliant
- Currency
- USD
- Datasheet
Specification
- Part Status Active
- Number of Positions 100
- Material Stainless Steel
- Pitch 0.016" (0.40mm)
- Thickness 0.0040" (0.102mm)
- Type BGA
- Inner Dimension -
- Thermal Center Pad -
- Outer Dimension 1.950" L x 1.350" W (49.53mm x 34.29mm)
- RoHS Status ROHS3 Compliant
- Moisture Sensitivity Level (MSL) 1 (Unlimited)
- REACH Status REACH Unaffected
- ECCN EAR99
- HTSUS 8534.00.0040
