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1354298

Part Number
1354298
Product Category
Solder
Manufacturer
Harimatec Inc.
Description
63S4 WS200 ACP 500G JAR
Packaging
Bulk
RoHS Status
RoHS Compliant
Currency
USD
PDF
Datasheet
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Specification

  • Part Status Obsolete
  • Wire Gauge -
  • Shelf Life Start Date of Manufacture
  • Diameter -
  • Composition Sn63Pb37 (63/37)
  • Melting Point 361°F (183°C)
  • Process Leaded
  • Flux Type Water Soluble
  • Shelf Life 6 Months
  • Shipping Info Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
  • Type Solder Paste
  • Mesh Type 3
  • Storage/Refrigeration Temperature 32°F ~ 50°F (0°C ~ 10°C)
  • Form Jar, 17.64 oz (500g)
  • RoHS Status RoHS non-compliant
  • Moisture Sensitivity Level (MSL) Not Applicable
  • ECCN EAR99
  • HTSUS 8311.30.3000

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